Product Information

Downsizing IC packages

[Changes in package varieties]

Smaller sizes, less thickness, and higher integration are required for semiconductor packages with higher processing speed, larger capacity and less power consumption for LSIs amid the growing demand for smartphones and tablet computers, and packaging technologies have accordingly advanced remarkably.

[Changes in package varieties]

[Case study]

In order to process tiny chips with high quality and precision blades are required to secure their sharpness, resistance to abrasion and shape maintenance. These contradictory requirements are difficult to meet for ordinary resins, metals and electroforming. But we can propose the selection of blades and processing technologies suitable for specific functions. The following are examples of processing for electroformed and resin blades.

Processing requirements

Workpiece IC Package Smaller chip sizes
Blade Electroforming Blades #600 Resin Blades #400
O.D. φ54mm, Blade thickness at 0.15mm

Comparative data

Comparative data

Comparative data

*Please ask our competent staff for details including blade specifications and processing methods.

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