Products
-
- “EcoMEP” Electroplated Wire : for slicing silicon ingots
- Electroplated diamond wire, EcoMEP, is a small-diameter, high-strength wire that has been electroplated with diamond grains using a special technique. It can be used to cut multiple slices of hard bri...
-
- Electroplated Diamond Band Saws
- Thin-band saws (consisting of an endless, high-strength steel band with an electroplated diamond cutting edge) is capable of cutting large-diameter silicon ingots and other large diameter materials ac...
-
- Diamond Wheels (Peripheral Grinding / Orientation Flat Processing)
- Metal bond wheels are used for the peripheral grinding of silicon ingots, or processing orientation flats to show the crystal orientation and processing notches. Based on our past experience in variou...
-
- ID Blades Slicing Silicon Ingots
- ID blades are used to slice silicon ingots and other semiconductive materials with a high degree of accuracy. ID blades have been developed to accommodate increasingly larger wafer sizes and are also ...
-
- OD Blades : for MONO & MULTI crystalline silicon ingot bricks
- Used for end-cutting, removing brick inclusions and squaring MONO and MULTI silicon. ...